Cavity Model for the Slot Radiation of an Enclosure Excited by Printed Circuit Board Traces With Different Loads

被引:5
|
作者
Poschalko, Christian [1 ]
Selberherr, Siegfried [2 ]
机构
[1] Robert Bosch AG, Diesel & Gasoline Syst, A-1110 Vienna, Austria
[2] Vienna Univ Technol, Inst Microelect, A-1040 Vienna, Austria
关键词
Cavity model; common-mode coupling; electrically equipped enclosures; radiated emission; ATTACHED CABLES; EMI; EMISSIONS; PLANES; FDTD;
D O I
10.1109/TEMC.2008.2008815
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Traces on a printed circuit board (PCB) couple to the cavity consisting of the PCB ground plane and a metallic enclosure cover. We introduce this common-mode coupling of a PCB trace to the cavity field by an analytical model that is verified with 3-D simulations using HFSS. The cavity field causes radiated emission from the slots of the cavity. For an accurate calculation of the cavity field inside the enclosure and the radiated emission, we consider the radiation loss by a multiport approach. Comparisons of the analytical results for the radiated field to measurements show good agreement. Radiated emission can be calculated for arbitrary geometric enclosure shapes as a function of frequency, position of the trace on the PCB, and trace load/driver impedances.
引用
收藏
页码:18 / 24
页数:7
相关论文
共 50 条
  • [21] Analysis of Emission From a Slot Nearby a Microstrip Line on a Printed Circuit Board
    Tobana, Teruo
    Sasamori, Takayuki
    Isota, Yoji
    2014 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, TOKYO (EMC'14/TOKYO), 2014, : 9 - 12
  • [22] Time domain coupling to a device on a printed circuit board inside a cavity
    Lertsirimit, C
    Jackson, DR
    Wilton, DR
    RADIO SCIENCE, 2005, 40 (06)
  • [23] FDTD modeling of printed circuit board signal integrity and radiation
    Fornberg, PE
    Byers, A
    Piket-May, M
    Holloway, CL
    2000 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD, 2000, : 307 - 312
  • [24] Analysis of the effect of shunt traces on the radiation from printed circuit boards
    Bokhari, SA
    1998 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, VOLS 1 AND 2, 1998, : 621 - 623
  • [25] The Secondary Electron Collection Effect of Biased Printed Circuit Board Traces in Box IEMPs
    Chen, Jinghui
    Zeng, Chao
    Deng, Jianhong
    Li, Zhengdi
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2022, 69 (02) : 143 - 151
  • [26] Time and frequency domain analysis for right angle corners on printed circuit board traces
    Montrose, MI
    1998 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, VOLS 1 AND 2, 1998, : 551 - 556
  • [27] Electromagnetic Coupling Analysis of Printed Circuit Board Traces using Characteristic Mode Analysis
    Durbhakula, Kalyan C.
    Lancaster, John
    Hassan, Ahmed M.
    Chatterjee, Deb
    Caruso, Anthony N.
    Hunter, James D.
    Liu, Yuanzhuo
    Beetner, Daryl G.
    Khilkevich, Victor
    2019 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND USNC-URSI RADIO SCIENCE MEETING, 2019, : 551 - 552
  • [28] Analysis of Electromagnetic Coupling Between Microstrip Line and Ground Slot on a Printed Circuit Board
    Tobana, Teruo
    Sasamori, Takayuki
    Isota, Yoji
    PROCEEDINGS OF THE 2016 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - EMC EUROPE, 2016, : 123 - 128
  • [29] Application of the model of the printed circuit board with regard to the topology of external conductive layers for calculation of the thermal conditions of the printed circuit board
    Rybakov, I. M.
    Goryachev, N. V.
    Kochegarov, I. I.
    Grishko, A. K.
    Brostilov, S. A.
    Yurkov, N. K.
    INTERNATIONAL CONFERENCE ON INFORMATION TECHNOLOGIES IN BUSINESS AND INDUSTRY 2016, 2017, 803
  • [30] Multidisciplinary placement optimization of heat generating electronic components on a printed circuit board in an. enclosure
    Suwa, Tohru
    Hadim, Harnid
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (03): : 402 - 410