DECOMPOSITION AND ASSAY OF GELATIN IN A COPPER PLATING BATH

被引:0
|
作者
KOURA, N
TSUTSUMI, A
WATANABE, K
机构
来源
PLATING AND SURFACE FINISHING | 1990年 / 77卷 / 09期
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:58 / 62
页数:5
相关论文
共 50 条
  • [41] PULSE PLATING WITH A TRIVALENT CHROMIUM PLATING BATH
    TU, ZM
    YANG, ZO
    ZHANG, JH
    PLATING AND SURFACE FINISHING, 1990, 77 (10): : 55 - 57
  • [42] Novel electroless plating copper additives for sodium hypophosphite system and its effect on the properties of plating bath and coating
    Li, Li-Qing
    Feng, Luo
    Wu, Pan-Wang
    Wu, Jing-Jie
    Huang, Zhi-Qiang
    Xu, Yong-Zhang
    Yang, Jia-Qi
    Ji, Shu-Rui
    Surface Technology, 2020, 49 (07): : 329 - 337
  • [43] RAPID ANALYSIS AND TROUBLESHOOTING OF GOLD, NICKEL, AND COPPER PLATING BATH CHEMISTRY BY CHROMATOGRAPHY
    HAAK, KK
    FRANKLIN, GO
    PLATING AND SURFACE FINISHING, 1983, 70 (05): : 22 - 22
  • [44] THE USE OF CYCLIC PULSE VOLTAMMETRIC STRIPPING FOR ACID COPPER PLATING BATH ANALYSIS
    FISHER, GL
    PELLEGRINO, PJ
    PLATING AND SURFACE FINISHING, 1987, 74 (02): : 48 - 48
  • [45] Gelatin bath recipe
    不详
    MATERIALS PERFORMANCE, 2000, 39 (03) : 13 - 13
  • [46] EFFECT OF COBALT IONS IN A PLATING BATH ON THE CHARACTERISTICS OF ELECTRODEPOSITED COPPER FOIL.
    Lokshtanova, O.G.
    Nalitova, G.P.
    Burkat, G.K.
    Kabanova, L.A.
    Journal of applied chemistry of the USSR, 1987, 60 (7 pt 2): : 1554 - 1558
  • [47] Bath Control technique by electrowinning of copper ion impurities in the process of gold plating
    Date, Kazuhiro
    Yoshihara, Sachio
    Nozawa, Junichi
    Nojiri, Naokatsu
    Journal of Japan Institute of Electronics Packaging, 2014, 17 (05) : 442 - 444
  • [48] THE USE OF CYCLIC PULSE VOLTAMMETRIC STRIPPING FOR ACID COPPER PLATING BATH ANALYSIS
    FISHER, GL
    PELLEGRINO, PJ
    PLATING AND SURFACE FINISHING, 1987, 74 (05): : 41 - 41
  • [49] Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath
    A. C. M. de Moraes
    J. L. P. Siqueira
    L. L. Barbosa
    I. A. Carlos
    Journal of Applied Electrochemistry, 2009, 39 : 369 - 375
  • [50] COPPER DEPOSIT FROM SULFATE AND CYANIDE PLATING BATH - INVESTIGATION BY ELECTRON MICROSCOPY
    OKADA, S
    MAGARI, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1955, 102 (09) : C225 - C225