共 50 条
- [21] WHAT ARE THE FUNCTIONS OF ALL THE CONSTITUENTS IN AN ELECTROLESS COPPER PLATING BATH PLATING AND SURFACE FINISHING, 1992, 79 (07): : 81 - 81
- [22] ACID COPPER BATH FOR THROUGH-HOLE PLATING. IBM technical disclosure bulletin, 1983, 26 (04): : 2173 - 2176
- [23] Copper plating on SUS 304 plate from acid bath MATERIALS PROCESSING TECHNOLOGIES, PTS 1 AND 2, 2011, 154-155 : 1008 - 1011
- [24] Analysis and control of copper plating bath additives and by-products CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY, 2003, 683 : 514 - 518
- [27] TITRIMERIC DETERMINATION OF GELATIN IN COPPER PLATING ELECTROLYTES (EXCHANGE OF EXPERIENCE) INDUSTRIAL LABORATORY, 1977, 43 (09): : 1210 - 1211
- [30] INFLUENCE OF CURRENT REVERSALS ON THE THROWING POWER OF A SULFATE COPPER PLATING BATH SOVIET ELECTROCHEMISTRY, 1991, 27 (03): : 269 - 273