HEAT SOURCES AND TEMPERATURE DISTRIBUTION IN INSULATED GATE BIPOLAR TRANSISTORS

被引:5
|
作者
Board, K. [1 ]
Mawby, P. A. [1 ]
机构
[1] Univ Coll Swansea, Dept Elect & Elect Engn, Swansea SA2 8PP, W Glam, Wales
关键词
D O I
10.1108/eb017496
中图分类号
O414.1 [热力学];
学科分类号
摘要
[No abstract available]
引用
收藏
页码:291 / 298
页数:8
相关论文
共 50 条
  • [31] Effect of solder layer crack on the thermal reliability of Insulated Gate Bipolar Transistors
    Du, Mingxing
    Guo, Qiuya
    Ouyang, Ziwei
    Wei, Kexin
    Hurley, William Gerard
    CASE STUDIES IN THERMAL ENGINEERING, 2019, 14
  • [32] The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)
    Pietruszka, Adrian
    Gorecki, Pawel
    Wronski, Sebastian
    Illes, Balazs
    Skwarek, Agata
    APPLIED SCIENCES-BASEL, 2021, 11 (12):
  • [33] Impact of Dormancy Periods on Power Cycling of Insulated Gate Bipolar Transistors (IGBTs)
    Valentine, Nathan
    Das, Diganta
    2016 IEEE ACCELERATED STRESS TESTING & RELIABILITY CONFERENCE (ASTR), 2016,
  • [34] Turn-on analysis of silicon insulated gate bipolar transistors with emitter trenches
    Machida, Satoru
    Yamashita, Yusuke
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2016, 55 (04)
  • [35] Influence of Junction Temperature on Reliability of an Insulated Gate Bipolar Transistor
    Kruthiventi, Sai Sarath
    Rayedi, Meghana Chowdary
    Nallamothu, Sivateja
    2018 7TH INTERNATIONAL CONFERENCE ON RELIABILITY, INFOCOM TECHNOLOGIES AND OPTIMIZATION (TRENDS AND FUTURE DIRECTIONS) (ICRITO) (ICRITO), 2018, : 168 - 174
  • [36] Screen-printed nanostructured composites as thermal interface materials for insulated gate bipolar transistors heat dissipation applications
    Chang, Tien-Chan
    Fuh, Yiin-Kuen
    Lee, Rui-Zhong
    Li-Yuan, Liu
    Lee, Yueh-Mu
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2016, 15 (04):
  • [37] Nonparametric Model-Based Online Junction Temperature and State-of-Health Estimation for Insulated Gate Bipolar Transistors
    Liu, Xiangxiang
    Jiao, Tianlei
    Das, Diganta
    Naqvi, Ijaz Haider
    Pecht, Michael
    IEEE ACCESS, 2021, 9 : 95304 - 95316
  • [38] Behaviour of punch-through and non-punch-through insulated gate bipolar transistors under high temperature gate bias stress
    Maiga, CO
    Tala-Ighil, B
    Toutah, H
    Boudart, B
    Proceedings of the IEEE-ISIE 2004, Vols 1 and 2, 2004, : 1035 - 1040
  • [39] A SELF-ALIGNED SHORT PROCESS FOR INSULATED-GATE BIPOLAR-TRANSISTORS
    CHOW, TP
    BALIGA, BJ
    GRAY, PV
    ADLER, MS
    CHANG, MF
    PIFER, GC
    YILMAZ, H
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (06) : 1317 - 1321
  • [40] Comparative analysis of static characteristics of insulated gate bipolar transistors and thyristors with static induction
    Bonomorskii O.I.
    Kyuregyan A.S.
    Gorbatyuk A.V.
    Ivanov B.V.
    Russian Electrical Engineering, 2015, 86 (2) : 93 - 97