DOPANT DIFFUSION IN TUNGSTEN SILICIDE

被引:36
|
作者
PAN, P
HSIEH, N
GEIPEL, HJ
SLUSSER, GJ
机构
[1] IBM, General Technology Division, Essex Junction, VT 05452, United States
关键词
Compendex;
D O I
10.1063/1.331050
中图分类号
O59 [应用物理学];
学科分类号
摘要
TUNGSTEN SILICON ALLOYS
引用
收藏
页码:3059 / 3062
页数:4
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