EFFECT OF TEXTURE AND GRAIN-STRUCTURE ON ELECTROMIGRATION IN AL-0.5-PERCENT CU THIN-FILMS

被引:0
|
作者
VAIDYA, S
机构
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C239 / C239
页数:1
相关论文
共 50 条
  • [21] ELECTROMIGRATION EFFECT ON LOW-FREQUENCY NOISE IN AL THIN-FILMS
    LIOU, DM
    GONG, J
    CHEN, CC
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1991, 30 (04): : 708 - 710
  • [22] DEGRADATION AND SUBSEQUENT HEALING BY ELECTROMIGRATION IN AL-1 WT PERCENT SI THIN-FILMS
    LI, Z
    BAUER, CL
    MAHAJAN, S
    MILNES, AG
    JOURNAL OF APPLIED PHYSICS, 1992, 72 (05) : 1821 - 1832
  • [23] DEGRADATION BY ELECTROMIGRATION IN PASSIVATED AL-1 WT-PERCENT SI THIN-FILMS
    LI, Z
    BAUER, CL
    MAHAJAN, S
    MILNES, AG
    APPLIED PHYSICS LETTERS, 1992, 61 (03) : 276 - 278
  • [24] TEM observations on the evolution of grain structure in pressurized Al-0.5Cu thin films
    Yang, HD
    Kim, CU
    Saran, M
    Le, HA
    MATERIALS RELIABILITY IN MICROELECTRONICS VIII, 1998, 516 : 121 - 126
  • [25] INFLUENCE OF OXYGEN ON THE DEVELOPMENT OF TEXTURE AND GRAIN MORPHOLOGY IN POLYCRYSTALLINE AL THIN-FILMS
    ADAMIK, M
    BARNA, PB
    TOMOV, I
    NONEQUILIBRIUM MATERIALS, 1995, 103 : 207 - 209
  • [26] INCUBATION-TIME FOR HOLE FORMATION DUE TO ELECTROMIGRATION IN AL AND AL-CU-AL THIN-FILMS
    HOROWITZ, SJ
    BLECH, IA
    JOURNAL OF ELECTRONIC MATERIALS, 1975, 4 (06) : 1171 - 1180
  • [27] ELECTROMIGRATION IN A1/CU THIN-FILMS WITH POLYIMIDE PASSIVATION
    LLOYD, JR
    THIN SOLID FILMS, 1981, 83 (02) : 207 - 207
  • [28] The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu-0.5% Si) thin films
    Yoo, S
    Eun, BS
    Kim, YH
    Chung, YC
    THIN SOLID FILMS, 2001, 382 (1-2) : 222 - 229
  • [29] COMPARISON OF MECHANICAL-PROPERTIES AND MICROSTRUCTURE OF AL(1 WT.PERCENT-SI) AND AL(1 WT.PERCENT-SI, 0.5 WT.PERCENT-CU) THIN-FILMS
    BADER, S
    KALAUGHER, EM
    ARZT, E
    THIN SOLID FILMS, 1995, 263 (02) : 175 - 184
  • [30] COMPOSITION, GRAIN-SIZE, AND PASSIVATION THICKNESS EFFECTS ON ELECTROMIGRATION IN AL-ALLOY THIN-FILMS
    FELTON, LE
    NORBURY, DH
    SCHWARZ, JA
    PASCO, RW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (08) : C325 - C325