FILM STRESS IN HIGH-DENSITY THIN-FILM INTERCONNECT

被引：5
|
作者：
PAN, JT
POON, S
机构：
来源：
ELECTRONIC PACKAGING MATERIALS SCIENCE IV | 1989年 / 154卷
关键词：
D O I：
10.1557/PROC-154-27
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：27 / 37
页数：11
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