A SURVEY OF RELIABILITY-PREDICTION PROCEDURES FOR MICROELECTRONIC DEVICES

被引：58
|
作者：
BOWLES, JB
机构：
[1] University of South Carolina, Columbia
来源：
IEEE TRANSACTIONS ON RELIABILITY | 1992年 / 41卷 / 01期
关键词：
RELIABILITY PREDICTION; MICROELECTRONIC DEVICE; RELIABILITY MODEL;
D O I：
10.1109/24.126662
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This article reviews six current reliability prediction procedures for micro-electronic devices. The device models are described and the parameters and parameter values used to calculate device failure rates are examined. The procedures are illustrated by using them to calculate the predicted failure rate for a 64K DRAM; the resulting failure rates are compared under a variety of assumptions. The models used in the procedures are similar in form, but they give very different predicted failure rates under similar operating and environmental conditions, and they show different sensitivities to changes in conditions affecting the failure rates.
引用
收藏
页码：2 / 12
页数：11
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