DYNAMIC BEHAVIOR OF SMT CHIP CAPACITORS DURING SOLDER REFLOW

被引：0
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作者：
ELLIS, JR
MASADA, GY
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来源：
SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY | 1989年
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TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
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页码：23 / 29
页数：7
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