THERMAL-ANALYSIS OF A DUAL-IN-LINE PACKAGE USING THE FINITE-ELEMENT METHOD

被引：5

|

作者：

HARDISTY, H

ABBOUD, J

机构：

来源：

IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION | 1987年 / 134卷 / 01期

关键词：

D O I：

10.1049/ip-i-1.1987.0004

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

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页码：23 / 31

页数：9

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