THE DESIGN AND EVALUATION OF MAINTAINABLE PACKAGING METHODS FOR ELECTRONIC EQUIPMENT

被引:1
|
作者
MCKENDRY, JM
CORSO, JF
GRANT, G
机构
关键词
D O I
10.1080/00140136008930488
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:255 / 272
页数:18
相关论文
共 50 条
  • [31] Packaging equipment
    Packaging (Boston), 1991, 36 (10):
  • [32] PACKAGING OF ELECTRONIC SIGNAL CONDITIONING EQUIPMENT FOR PROJECT APOLLO LUNAR MODULE
    YABROUDY, G
    AVERSANO, F
    SAVINO, R
    GAYLO, B
    SAE TRANSACTIONS, 1968, 76 : 92 - &
  • [33] Packaging equipment
    1600, (36):
  • [34] DESIGN AUTOMATION COMES TO ELECTRONIC SYSTEM PACKAGING
    MILNE, B
    ELECTRONIC DESIGN, 1988, 36 (03) : 43 - &
  • [35] Packaging equipment
    Snyder, MR
    MODERN PLASTICS, 1996, 73 (07): : 81 - 81
  • [36] Equipment for packaging
    Baryshev, I.N.
    Egorov, I.A.
    Khimicheskoe I Neftegazovoe Mashinostroenie, 1996, (05): : 19 - 22
  • [37] Packaging design concept simulator for electronic circuit
    Kojima, Toosaku
    Nomoto, Tazu
    Systems and Computers in Japan, 2000, 31 (01) : 59 - 69
  • [38] ADVANCED ELECTRONIC PACKAGING AND CONNECTOR DESIGN TECHNIQUES
    SCHWARTZ, L
    PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1968, (MAY): : 335 - &
  • [40] Comprehensive Evaluation of Electronic Product Packaging Protection
    Wang, Xin
    Guo, Yan-feng
    Fu, Yun-gang
    Yan, Yu
    THIRTEENTH NATIONAL CONFERENCE ON PACKAGING ENGINEERING, TNCPE 13, 2010, : 46 - 50