FINA METAL PROCESS AND ITS DEVELOPMENT

被引:0
|
作者
BEAUMONT, FV
机构
来源
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:207 / &
相关论文
共 50 条
  • [31] Development of Metal Plate with Internal Structure Utilizing the Metal Injection Molding (MIM) Process
    Shin, Kwangho
    Heo, Youngmoo
    Park, Hyungpil
    Chang, Sungho
    Rhee, Byungohk
    MATERIALS, 2013, 6 (12) : 5878 - 5892
  • [32] The technology of metal powder injection molding and its development
    2001, Changsha Research Institute of Mining and Metallurgy (21):
  • [33] The change of the characteristics of metal through its development.
    Tammann, G
    ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE--STOCHIOMETRIE UND VERWANDTSCHAFTSLEHRE, 1912, 80 (06): : 687 - 700
  • [34] DEVELOPMENT OF THE LONDON METAL EXCHANGE AND ITS PROSPECTS FOR 1979
    EVERS, JH
    METALL, 1979, 33 (02): : 189 - 190
  • [35] Development of all metal electrothermal actuator and its applications
    Luo, JJ
    He, JH
    Flewitt, A
    Moore, DF
    Spearing, SM
    Fleck, NA
    Milne, WI
    JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS, 2005, 4 (02): : 1 - 9
  • [36] EFFECT OF THE GENERAL AND LOCAL CURVATURE OF THE SURFACE OF A METAL ON ITS MICROGEOMETRY IN THE PROCESS OF ITS DISSOLUTION
    KRICHMAR, SI
    ZHURNAL FIZICHESKOI KHIMII, 1963, 37 (05): : 1148 - 1150
  • [37] Development of a process for biodetoxification of metal cyanides from waste waters
    Patil, YB
    Paknikar, KM
    PROCESS BIOCHEMISTRY, 2000, 35 (10) : 1139 - 1151
  • [38] Development of a dry process for coating metal nanoparticles on carbon nanotubes
    Bamba, Yoshinori
    Shimizu, Tetsuhide
    Yang, Ming
    MECHANICAL ENGINEERING JOURNAL, 2015, 2 (02):
  • [39] Development of semi-dieless metal bellows forming process
    Furushima, Tsuyoshi
    Nguyen Quang Hung
    Manabe, Ken-ichi
    Sasaki, Osamu
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2013, 213 (08) : 1406 - 1411
  • [40] Development of spin-on-glass process for triple metal interconnects
    彭力
    赵文彬
    王国章
    于宗光
    半导体学报, 2010, 31 (12) : 143 - 145