HOT-CARRIER DEGRADATION OF NMOSTS STRESSED AT 4.2-K

被引:2
|
作者
SIMOEN, E
CLAEYS, C
机构
[1] IMEC, B-3001 Leuven
关键词
D O I
10.1016/0038-1101(93)90262-O
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Results of a systematic study of the degradation behaviour of nMOSTs stressed at 4.2 K will be reported. It will be shown that the stress-induced changes can be classified in reversible and irreversible (permanent) degradation, which strongly depend on the operation conditions during stress. The reversible changes are mainly related to hole-trapping in the body of the transistor and are accompanied by a decrease of the threshold voltage and a small transconductance overshoot. The effect of Channel Hot Carrier (CHC) stress on the typical 4.2 K anomalies (kink/hysteresis) will also be addressed and briefly discussed in view of recently published models.
引用
收藏
页码:527 / 532
页数:6
相关论文
共 50 条
  • [1] PERIODIC OSCILLATIONS AND TURBULENCE OF HOT-CARRIER PLASMA AT 4.2-K IN N-GAAS
    AOKI, K
    KOBAYASHI, T
    YAMAMOTO, K
    JOURNAL DE PHYSIQUE, 1981, 42 (NC7): : 51 - 56
  • [2] SUBSTRATE CURRENT CHARACTERISTIC OF SI NMOSTS AND PMOSTS AT 4.2-K
    SIMOEN, E
    CLAEYS, C
    SOLID STATE COMMUNICATIONS, 1992, 82 (05) : 341 - 343
  • [3] METASTABLE CHARGE-TRAPPING EFFECT IN SOI NMOSTS AT 4.2-K
    SIMOEN, E
    GAO, MH
    COLINGE, JP
    CLAEYS, C
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 1993, 8 (03) : 423 - 428
  • [4] LOW-FREQUENCY NOISE BEHAVIOR OF SI NMOSTS STRESSED AT 4.2 K
    SIMOEN, E
    DIERICKX, B
    CLAEYS, CL
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (07) : 1296 - 1299
  • [5] On the Temperature Behavior of Hot-Carrier Degradation
    Tyaginov, S.
    Jech, M.
    Sharma, P.
    Franco, J.
    Kaczer, B.
    Grasser, T.
    2015 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2015, : 143 - 146
  • [6] Monitoring hot-carrier degradation in SOI MOSFET's by hot-carrier luminescence techniques
    Selmi, L
    Pavesi, M
    Wong, HSP
    Acovic, A
    Sangiorgi, E
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (05) : 1135 - 1139
  • [7] Hot Carrier Degradation in MOSFETs at Cryogenic Temperatures Down to 4.2 K
    Zhang, Yuanke
    Xu, Jun
    Lu, Teng-Teng
    Zhang, Yujing
    Luo, Chao
    Guo, Guoping
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2021, 21 (04) : 620 - 626
  • [8] Modeling of hot-carrier stressed characteristics of submicrometer pMOSFETs
    Jang, SL
    Tang, TH
    Chen, YS
    Sheu, CJ
    SOLID-STATE ELECTRONICS, 1996, 39 (07) : 1043 - 1049
  • [9] Modeling of hot-carrier stressed characteristics of submicrometer pMOSFETs
    Natl Taiwan Inst of Technology, Taipei, Taiwan
    Solid State Electron, 7 (1043-1049):
  • [10] Reliability evaluation of Gilbert cell mixer based on a hot-carrier stressed device degradation model
    Lin, WC
    Du, LJ
    King, YC
    2004 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2004, : 387 - 390