A NOVEL-APPROACH - THERMOPLASTIC DIE ATTACH ADHESIVE

被引：0

作者：

YING, L ^{[1
]}

机构：

[1] M&T CHEM INC,RAHWAY,NJ

来源：

SOLID STATE TECHNOLOGY | 1987年 / 30卷 / 09期

关键词：

DIES; -; Adhesion; THERMOPLASTICS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel approach to die bonding using a thermoplastic adhesive is described. The thermoplastic adhesive, which requires no cure, offers a number of advantages in die attach applications. There is also a discussion of other die bonding materials such as gold-silicon eutectic, epoxy and polyamic acid products currently available on the market.

引用

页码：107 / 109

页数：3

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