METAL ALKOXIDES AS PRECURSORS FOR THIN-FILM GROWTH

被引:45
|
作者
BRADLEY, DC
机构
关键词
D O I
10.1098/rsta.1990.0010
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
引用
收藏
页码:167 / 171
页数:5
相关论文
共 50 条
  • [31] Interactions between radical growth precursors on plasma-deposited silicon thin-film surfaces
    Bakos, Tamas
    Valipa, Mayur S.
    Maroudas, Dimitrios
    JOURNAL OF CHEMICAL PHYSICS, 2007, 126 (11):
  • [32] Screening of metal flux for SiC solution growth by a thin-film combinatorial method
    Yonezawa, Yoshiyuki
    Ryo, Mina
    Takigawa, Aki
    Matsumoto, Yuji
    SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2011, 12 (05)
  • [33] Metal silicide-mediated microcrystalline silicon thin-film growth for photovoltaics
    Kim, Joondong
    Anderson, Wayne A.
    SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2007, 91 (06) : 534 - 538
  • [34] EPITAXIAL-GROWTH OF TETRAPHENYL-PORPHYRINATO METAL EVAPORATED THIN-FILM
    HAYASHI, S
    YANAGI, H
    ASHIDA, M
    JOURNAL OF ELECTRON MICROSCOPY, 1991, 40 (04): : 300 - 300
  • [35] METAL-ON-METAL THIN-FILM GROWTH - AU/NI(001) AND NI/AU(001)
    LUEDTKE, WD
    LANDMAN, U
    PHYSICAL REVIEW B, 1991, 44 (11): : 5970 - 5972
  • [36] DESIGN AND SYNTHESIS OF CVD PRECURSORS TO THIN-FILM CERAMIC MATERIALS
    INTERRANTE, LV
    AMATO, C
    LARKIN, D
    HUDSON, J
    HAN, B
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1990, 200 : 27 - COLL
  • [37] SOL-GEL PROCESSING OF NASICON THIN-FILM PRECURSORS
    AHMAD, A
    GLASGOW, C
    WHEAT, TA
    SOLID STATE IONICS, 1995, 76 (1-2) : 143 - 154
  • [38] DESIGN AND SYNTHESIS OF CVD PRECURSORS TO THIN-FILM CERAMIC MATERIALS
    INTERRANTE, LV
    HAN, B
    HUDSON, JB
    WHITMARSH, C
    APPLIED SURFACE SCIENCE, 1990, 46 (1-4) : 5 - 8
  • [39] PREPARATION OF YBCO SUPERCONDUCTOR THIN-FILM BY SPIN-COATING METHOD WITH METAL-ORGANIC PRECURSORS
    FANG, SC
    HUANG, CH
    CHEN, IC
    LIAW, CF
    HURNG, WM
    JOURNAL OF MATERIALS SCIENCE, 1994, 29 (01) : 99 - 102
  • [40] On the formation of voids in thin-film metal interconnects
    Shen, YL
    SCRIPTA MATERIALIA, 1997, 37 (11) : 1805 - 1810