THERMAL CALCULATION OF WELDING TRANSFORMERS FILLED WITH AN EPOXY COMPOUND

被引：0
|
作者：
GLEBOV, LV
GORLOV, YI
机构：
来源：
AUTOMATIC WELDING USSR | 1970年 / 23卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：59 / &
相关论文
共 50 条
  • [31] Thermal conductivity epoxy resin composites filled with boron nitride
    Gu, Junwei
    Zhang, Qiuyu
    Dang, Jing
    Xie, Chao
    POLYMERS FOR ADVANCED TECHNOLOGIES, 2012, 23 (06) : 1025 - 1028
  • [32] Thermal conductivity of microPCMs-filled epoxy matrix composites
    Su, Jun-Feng
    Wang, Xin-Yu
    Huang, Zhen
    Zhao, Yun-Hui
    Yuan, Xiao-Yan
    COLLOID AND POLYMER SCIENCE, 2011, 289 (14) : 1535 - 1542
  • [33] A Review of Thermal Conductivity of Epoxy Composites Filled with AIN or BN
    Samek, Josef
    Ondrusek, Cestmir
    Kurfurst, Jiri
    2017 1ST IEEE INTERNATIONAL CONFERENCE ON ENVIRONMENT AND ELECTRICAL ENGINEERING AND 2017 17TH IEEE INDUSTRIAL AND COMMERCIAL POWER SYSTEMS EUROPE (EEEIC / I&CPS EUROPE), 2017,
  • [34] Characterization of electro-thermal aging of a filled epoxy resin
    Guillermin, C
    Rain, P
    Rowe, SW
    PROCEEDINGS OF THE 2004 IEEE INTERNATIONAL CONFERENCE ON SOLID DIELECTRICS, VOLS 1 AND 2, 2004, : 351 - 354
  • [35] FILLED EPOXY POLYMER WITH LOW THERMAL-EXPANSION COEFFICIENT
    SHAPOVALENKO, VV
    TYKACHINSKII, ID
    KATAEVA, GV
    PYATNITSKAYA, VV
    INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 1976, 19 (06) : 1835 - 1837
  • [36] THERMAL-CONDUCTIVITY OF EPOXY ADHESIVES FILLED WITH SILVER PARTICLES
    BJORNEKLETT, A
    HALBO, L
    KRISTIANSEN, H
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1992, 12 (02) : 99 - 104
  • [37] IMPROVED THERMAL CONDUCTIVITY OF COMPOSITE PARTICLES FILLED EPOXY RESIN
    Zhang, Xiuju
    Lin, Zhidan
    Li, Bo
    Tan, Shaozao
    HIGH PERFORMANCE STRUCTURES AND MATERIALS ENGINEERING, PTS 1 AND 2, 2011, 217-218 : 439 - 444
  • [38] Thermal and mechanical analysis of anthracene-filled epoxy nanocomposites
    Messman, Jamie M.
    Wells, Sabrina M.
    Sarkar, Somnath
    Bowen, Daniel E.
    Morris, Theresa
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2014, 248
  • [39] Thermal degradation mechanisms of epoxy composites filled with tin particles
    Arshad, Muhammad Azeem
    Maaroufi, AbdelKrim
    Benavente, Rosario
    Pinto, Gabriel
    POLYMER COMPOSITES, 2017, 38 (08) : 1529 - 1540
  • [40] Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
    Zeng, Jun
    Fu, Renli
    Agathopoulos, Simeon
    Zhang, Shaodong
    Song, Xiufeng
    He, Hong
    JOURNAL OF ELECTRONIC PACKAGING, 2009, 131 (04) : 0410061 - 0410067
12345