共 50 条
- [41] Novel electroless plating copper additives for sodium hypophosphite system and its effect on the properties of plating bath and coating Surface Technology, 2020, 49 (07): : 329 - 337
- [42] RAPID ANALYSIS AND TROUBLESHOOTING OF GOLD, NICKEL, AND COPPER PLATING BATH CHEMISTRY BY CHROMATOGRAPHY PLATING AND SURFACE FINISHING, 1983, 70 (05): : 22 - 22
- [43] THE USE OF CYCLIC PULSE VOLTAMMETRIC STRIPPING FOR ACID COPPER PLATING BATH ANALYSIS PLATING AND SURFACE FINISHING, 1987, 74 (02): : 48 - 48
- [44] EFFECT OF COBALT IONS IN A PLATING BATH ON THE CHARACTERISTICS OF ELECTRODEPOSITED COPPER FOIL. Journal of applied chemistry of the USSR, 1987, 60 (7 pt 2): : 1554 - 1558
- [46] THE USE OF CYCLIC PULSE VOLTAMMETRIC STRIPPING FOR ACID COPPER PLATING BATH ANALYSIS PLATING AND SURFACE FINISHING, 1987, 74 (05): : 41 - 41
- [47] Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath Journal of Applied Electrochemistry, 2009, 39 : 369 - 375
- [50] THE USE OF CYCLIC PULSE VOLTAMMETRIC STRIPPING FOR ACID COPPER PLATING BATH ANALYSIS PLATING AND SURFACE FINISHING, 1988, 75 (06): : 88 - 93