A CONDUCTION-COOLED MODULE FOR HIGH-PERFORMANCE LSI DEVICES

被引：42
作者：
OKTAY, S [1 ]
KAMMERER, HC [1 ]
机构：
[1] IBM CORP,DATA SYST DIV LAB,POUGHKEEPSIE,NY 12602
来源：
IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1982年 / 26卷 / 01期
关键词：
D O I：
10.1147/rd.261.0055
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：55 / 66
页数：12
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