CONDUCTION COOLING FOR AN LSI PACKAGE - A ONE-DIMENSIONAL APPROACH

被引：63

作者：

CHU, RC

HWANG, UP

SIMONS, RE

机构：

来源：

关键词：

D O I：

10.1147/rd.261.0045

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：45 / 54

页数：10

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