FIELD-MEASUREMENTS NEAR HIGH-DENSITY STATICALLY RECORDED TRANSITIONS IN A THIN-FILM MEDIUM

被引：3

作者：

BAIRD, AW ^{[1
]}

CHAURETTE, WF ^{[1
]}

LUSTIG, CD ^{[1
]}

机构：

[1] SPERRY RAND CORP,DEPT ELECTR DEVICES,APPL PHYS LAB,SUDBURY,MA 01776

来源：

IEEE TRANSACTIONS ON MAGNETICS | 1981年 / 17卷 / 06期

关键词：

D O I：

10.1109/TMAG.1981.1061522

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：2553 / 2555

页数：3

共 50 条

[21] MAGNETIZATION STRUCTURES OF TRACKS RECORDED ON LONGITUDINAL THIN-FILM MEDIUM
HONDA, Y
INABA, N
SUZUKI, M
KIKUGAWA, A
FUTAMOTO, M
IEEE TRANSACTIONS ON MAGNETICS, 1993, 29 (06) : 3721 - 3723
[22] POLE-TIP DESIGN OF HIGH-DENSITY RECORDING THIN-FILM HEADS
AOI, H
SAITOH, M
TAMURA, T
OHURA, M
TSUCHIYA, H
HAYASHI, M
IEEE TRANSACTIONS ON MAGNETICS, 1982, 18 (06) : 1137 - 1139
[23] CONTROL OF THIN-FILM MATERIALS PROPERTIES USED IN HIGH-DENSITY MULTICHIP INTERCONNECT
RECHE, JJH
ELECTRONIC PACKAGING MATERIALS SCIENCE IV, 1989, 154 : 39 - 46
[24] BENZOCYCLOBUTENE (BCB) DIELECTRICS FOR THE FABRICATION OF HIGH-DENSITY, THIN-FILM MULTICHIP MODULES
BURDEAUX, D
TOWNSEND, P
CARR, J
GARROU, P
JOURNAL OF ELECTRONIC MATERIALS, 1990, 19 (12) : 1357 - 1364
[25] BA-FERRITE THIN-FILM MEDIA FOR HIGH-DENSITY LONGITUDINAL RECORDING
HYLTON, TL
PARKER, MA
ULLAH, M
COFFEY, KR
UMPHRESS, R
HOWARD, JK
JOURNAL OF APPLIED PHYSICS, 1994, 75 (10) : 5960 - 5965
[26] OPTIMIZATION OF THIN-FILM HEADS FOR HIGH-DENSITY DISK RECORDING ON PARTICULATE MEDIA
ROSCAMP, TA
ROBERTS, GE
FRANK, PD
IEEE TRANSACTIONS ON MAGNETICS, 1980, 16 (05) : 973 - 975
[27] PHYSICAL LIMITS OF HIGH-DENSITY RECORDING IN METALLIC MAGNETIC THIN-FILM MEDIA
CHEN, T
MARTIN, RM
IEEE TRANSACTIONS ON MAGNETICS, 1979, 15 (06) : 1444 - 1446
[28] DEVELOPMENT OF A HIGH-DENSITY FINITE-SET OF UNIFORM-FIELD EMITTERS ON A THIN-FILM GLASS SUBSTRATE
KITZMANN, GA
JOURNAL DE PHYSIQUE, 1986, 47 (C-2): : 79 - 83
[29] GENERAL-ANALYSIS OF NOISE IN RECORDED TRANSITIONS IN THIN-FILM RECORDING MEDIA
BERTRAM, HN
CHE, XD
IEEE TRANSACTIONS ON MAGNETICS, 1993, 29 (01) : 201 - 208
[30] Effect of adhesive layer properties on interfacial fracture in thin-film high-density interconnects
Modi, M
Sitaraman, SK
52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 847 - 853

← 1 2 3 4 5 →