ACTIVATION OF A COPPER SURFACE BY AMMONIUM-CHLORIDE DURING CHEMICAL NICKEL PLATING

被引:0
|
作者
EPIFANOVA, VS
PRUSOV, YV
FLEROV, VN
机构
来源
PROTECTION OF METALS | 1978年 / 14卷 / 02期
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
引用
收藏
页码:183 / 185
页数:3
相关论文
共 50 条
  • [21] Activation of Ceramics by Nickel Nanoparticles for Electroless Copper Plating
    Ma Hongfang
    Ding Yanguang
    Ren Yuan
    Liu Wenfei
    Ma Fang
    Wang Xiaorui
    RARE METAL MATERIALS AND ENGINEERING, 2013, 42 : 509 - 512
  • [22] Chemical nickel plating on carbon fibre surface
    Shu, Weiguo
    Zhang, Lianfeng
    Hangkong Gongyi Jishu/Aeronautical Manufacturing Technology, (06): : 27 - 28
  • [23] Electrodeposition of Zinc–Nickel Coatings from Glycine-Containing Ammonium-Chloride Electrolyte
    D. V. Burlyaev
    A. E. Tinaeva
    K. E. Tinaeva
    O. A. Kozaderov
    Protection of Metals and Physical Chemistry of Surfaces, 2020, 56 : 552 - 559
  • [24] TITRIMETRIC DETERMINATION OF COPPER(II) IN SOLUTIONS FOR CHEMICAL NICKEL PLATING AND COBALT PLATING
    TAROZAIT.VK
    NORKUS, PK
    LUNYATSK.AM
    INDUSTRIAL LABORATORY, 1971, 37 (08): : 1171 - &
  • [25] KINETICS OF COMPLEX PARALLEL DISCHARGE IN AMMONIUM SOLUTIONS OF CHEMICAL NICKEL PLATING
    SARANOV, EI
    SOLOVEVA, GV
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA, 1989, 32 (07): : 76 - 79
  • [26] Nickel microneedles fabricated by sequential copper and nickel electroless plating and copper chemical wet etching
    Jung, Phill Gu
    Lee, Tae Won
    Oh, Dong Joon
    Hwang, Sung Jin
    Jung, Im Deok.
    Lee, Sang Min
    Ko, Jong Soo
    SENSORS AND MATERIALS, 2008, 20 (01) : 45 - 53
  • [27] CHEMICAL EFFECTS INDUCED BY GAMMA-IRRADIATED AMMONIUM-CHLORIDE IN AQUEOUS-MEDIUM
    RAVISHANKAR, D
    CHABRIA, N
    JOURNAL OF RADIOANALYTICAL AND NUCLEAR CHEMISTRY-LETTERS, 1989, 135 (04): : 265 - 272
  • [28] Electrodeposition of Zinc-Nickel Coatings from Glycine-Containing Ammonium-Chloride Electrolyte
    Burlyaev, D., V
    Tinaeva, A. E.
    Tinaeva, K. E.
    Kozaderov, O. A.
    PROTECTION OF METALS AND PHYSICAL CHEMISTRY OF SURFACES, 2020, 56 (03) : 552 - 559
  • [29] Determination of copper, nickel, sodium hydroxide, and formaldehyde in solutions for chemical copper plating
    Drozd, AV
    Per'kov, IG
    Artsebashev, GV
    Shibina, IV
    INDUSTRIAL LABORATORY, 1997, 63 (07): : 392 - 395
  • [30] Palladium-Copper Inter-diffusion during Copper Activation for Electroless Nickel Plating Process on Copper Power Metal
    Yee, Poo Khai
    Wai, Wan Tatt
    Khong, Yong Foo
    2014 IEEE 21ST INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2014, : 219 - 222