COMPETITIVE MECHANISMS IN REACTIVE ION ETCHING IN A CF4 PLASMA

被引:50
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作者
SCHWARTZ, GC
ROTHMAN, LB
SCHOPEN, TJ
机构
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D O I
10.1149/1.2129063
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:464 / 469
页数:6
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