HOT-PRESSING - A NEW ROUTE TO HIGH-PERFORMANCE CERAMIC MULTILAYER ELECTRONIC PACKAGES

被引：0
|
作者：
RICE, RW
ENLOE, JH
LAU, JW
LUH, EY
DOLHERT, LE
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1992年 / 71卷 / 05期
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D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
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页码：751 / &
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