Characterization of the Thermal Interface Material (TIM) of a microprocessor

被引：0
|
作者：
Alberto Salazar-Jimenez, Jose [1 ]
机构：
[1] Inst Tecnol Costa Rica, Escuela Ciencia & Ingn Mat, Cartago, Costa Rica
来源：
TECNOLOGIA EN MARCHA | 2013年 / 26卷 / 04期
关键词：
Thermal Interface Material; Microprocessor; SEM; EDX;
D O I：
暂无
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
Thermal Interface Materials (TIM) are materials which are used in microelectronics, mainly in microprocessors, to improve the yield of heat transfer between the silicon die and the copper heat sink, replacing the trapped air in this area due to the surface roughness of both components. The heat transfer in this material depends mostly of its chemical composition and its thickness. This work deals with the measure of thickness and the determination of chemical composition for the TIM of an Intel Pentium 4 microprocessor, using a scanning electron microscope (SEM) equipped with energy-dispersive x-ray spectrometer (EDX), present in the Nanotechnology Laboratory of the ITCR.
引用
收藏
页码：36 / 41
页数：6
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