Characterization of the Thermal Interface Material (TIM) of a microprocessor

被引：0
|
作者：
Alberto Salazar-Jimenez, Jose [1 ]
机构：
[1] Inst Tecnol Costa Rica, Escuela Ciencia & Ingn Mat, Cartago, Costa Rica
来源：
TECNOLOGIA EN MARCHA | 2013年 / 26卷 / 04期
关键词：
Thermal Interface Material; Microprocessor; SEM; EDX;
D O I：
暂无
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
Thermal Interface Materials (TIM) are materials which are used in microelectronics, mainly in microprocessors, to improve the yield of heat transfer between the silicon die and the copper heat sink, replacing the trapped air in this area due to the surface roughness of both components. The heat transfer in this material depends mostly of its chemical composition and its thickness. This work deals with the measure of thickness and the determination of chemical composition for the TIM of an Intel Pentium 4 microprocessor, using a scanning electron microscope (SEM) equipped with energy-dispersive x-ray spectrometer (EDX), present in the Nanotechnology Laboratory of the ITCR.
引用
收藏
页码：36 / 41
页数：6
相关论文
共 50 条
  • [1] How TIM impacts thermal performance of electronics: A thermal point of view study to understand impact of Thermal Interface Material (TIM)
    Kesarkar, Tejas Manohar
    Sardana, Nitesh Kumar
    2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019), 2019, : 200 - 206
  • [2] Thermal characterization of thermal interface material bondlines
    Fullem, T. Z.
    Rae, D. F.
    Sharma, A.
    Wolcott, J. A.
    Cotts, E. J.
    2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 174 - 179
  • [3] Technical Review of Characterization Methods for Thermal Interface Materials (TIM)
    Goel, Nitin
    Bhattacharya, A.
    Cervantes, Joseph A.
    Mongia, Rajiv K.
    Machiroutu, Sridhar V.
    Lin, Hau-Lan
    Huang, Ya-Chi
    Fan, Kuang-Cheng
    Denq, Bar-Long
    Liu, Chen-Hua
    Lin, Chun-Hung
    Tien, Chi-Wei
    Pan, Jenq-Haur
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1461 - +
  • [4] Technical review of characterization methods for thermal interface materials (tim)
    Goel, Nitin
    Anoop, T. K.
    Bhattacharya, A.
    Cervantes, Joseph A.
    Mongia, Rajiv K.
    Machiroutu, Sridhar V.
    Lin, Hau-Lan
    Huang, Ya-Chi
    Fan, Kuang-Cheng
    Denq, Bar-Long
    Liu, Chen-Hua
    Lin, Chun-Hung
    Tien, Chi-Wei
    Pan, Jenq-Haur
    2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 248 - +
  • [5] Characterization of a thermal interface material for burn-in application
    Dean, NF
    Gupta, A
    ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS, 2000, : 36 - 41
  • [6] Dynamic characterization of thermal interface material for electronic cooling
    Shih, R
    Bash, CE
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 2, 2003, : 159 - 166
  • [7] Characterization of a thermal interface material for burn-in application
    Honeywell Electronic Materials, Spokane, United States
    Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2000, 1 : 36 - 41
  • [8] Heat transfer performance of a compact heat exchanger based on metal foam and Thermal Interface Material (TIM)
    Zaib, Fathiah
    Ganesan, P.
    Zaharinie, Tuan
    Chen, Zhenqian
    Naganthran, Kohilavani
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2024, 231
  • [9] Characterization of a liquid-metal microdroplet thermal interface material
    Hamdan, A.
    McLanahan, A.
    Richards, R.
    Richards, C.
    EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2011, 35 (07) : 1250 - 1254
  • [10] Characterization of a dielectric microdroplet thermal interface material with dispersed nanoparticles
    A. Hamdan
    F. Sahli
    R. Richards
    C. Richards
    Journal of Nanoparticle Research, 2012, 14
12345