ENCAPSULANTS REAP NEW USES FOR CHIP-ON-BOARD TECHNOLOGY

被引：0
|
作者：
CHIN, S
机构：
来源：
ELECTRONIC PRODUCTS MAGAZINE | 1990年 / 32卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：22 / 22
页数：1
相关论文
共 50 条
  • [1] CONSIDERATIONS FOR CHOOSING CHIP-ON-BOARD ENCAPSULANTS.
    Burkhart, Art
    Bonneau, Mark
    Electri-onics, 1985, 31 (10): : 67 - 69
  • [2] Use of microwave technology for rapid cure of chip-on-board glob top encapsulants
    Wei, JB
    Fathi, Z
    Pan, B
    Nah, CK
    Chan, SL
    PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 181 - 185
  • [3] CHIP-ON-BOARD TECHNOLOGY CHUGS ALONG
    CHIN, S
    ELECTRONIC PRODUCTS MAGAZINE, 1987, 29 (19): : 37 - 40
  • [4] Miniaturization of space electronics with chip-on-board technology
    APL's Principal Professional Staff, United States
    不详
    不详
    不详
    不详
    不详
    不详
    不详
    Johns Hopkins APL Tech Dig, 1 (50-60):
  • [5] Tests prove reliability of "chip-on-board" technology
    Riches, Steve
    MICROELECTRONICS INTERNATIONAL, 2007, 24 (03) : 78 - 79
  • [6] Miniaturization of space electronics with chip-on-board technology
    Le, BQ
    Nhan, E
    Maurer, RH
    Jenkins, RE
    Lew, AL
    Feldmesser, HS
    Lander, JR
    JOHNS HOPKINS APL TECHNICAL DIGEST, 1999, 20 (01): : 50 - 61
  • [7] CHIP-ON-BOARD TECHNOLOGY CHUGS ALONG.
    Chin, Spencer
    Electronic Products (Garden City, New York), 1987, 29 (19): : 37 - 40
  • [8] New Probabilistic Reliability Model Describing the Risk of Chip Fracture in the Chip-On-Board Technology
    Steiert, Matthias
    Wilde, Juergen
    2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
  • [9] Thermal performance comparison of chip-on-board, flip chip-on-board and standard TQFP package
    Iliev, SK
    FOURTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1998, : 161 - 168
  • [10] White LEDs and modules in chip-on-board technology for general lighting
    Hartmann, Paul
    Wenzl, Franz P.
    Sommer, Christian
    Pachler, Peter
    Hoschopf, Flans
    Schweighart, Marko
    Hartmann, Martin
    Kuna, Ladislav
    Jakopic, Georg
    Leising, Guenther
    Tasch, Stefan
    SIXTH INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2006, 6337
12345