SANDERS STRESSES MILITARY ELECTRONICS

被引：0

|

作者：

不详

机构：

来源：

AVIATION WEEK & SPACE TECHNOLOGY | 1983年 / 118卷 / 10期

关键词：

D O I：

暂无

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

引用

收藏

页码：66 / 66

页数：1

相关论文

共 50 条

[41] Superconducting hybrid power electronics for military systems
Curcic, T
Wolf, SA
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2005, 15 (02) : 2364 - 2369
[42] PROBLEMS OF RELIABILITY GROWTH AND DEMONSTRATION WITH MILITARY ELECTRONICS
GREEN, JE
MICROELECTRONICS AND RELIABILITY, 1973, 12 (06): : 513 - 520
[43] Low-residue soldering of military electronics
Koon, Jeff
Burress, Bob
Circuits Assembly, 1995, 6 (04):
[44] From the president: Military/Aero trends in electronics
Imhoff, Howard J.
Advancing Microelectronics, 2010, 37 (02):
[45] MILITARY ELECTRONICS - VIDEO COMPRESSION PICTURE IS CLEARING
ARMSTRONG, L
ELECTRONICS, 1978, 51 (11): : 96 - 97
[46] The Influence of Compressive Stresses on the Properties of Inductive Electronics Components
Salach, J.
Nowak, P.
ACTA PHYSICA POLONICA A, 2018, 133 (04) : 1053 - 1055
[47] High density electronics packaging assessment for military environment
Siméus, EJ
Stegura, SR
Mehrotra, M
Smedley, RW
FIFTH ANNUAL PAN PACIFIC MICROELECTRONICS SYMPOSIUM, PROCEEDINGS, 2000, : 107 - 112
[48] FRANCES ELECTRONICS INDUSTRY WANTS MORE MILITARY SPENDING
GEE, J
ELECTRONICS-US, 1993, 66 (08): : 5 - 5
[49] MILITARY ELECTRONICS: PACKAGING FOR LAND, SEA AND AIR.
Markstein, Howard W.
Electronic Packaging and Production, 1985, 25 (06): : 108 - 113
[50] DIGEST OF MILITARY ELECTRONICS - RCA-SERVICE-CO
不详
DATA PROCESSING, 1962, 4 (06): : 64 - 64

← 1 2 3 4 5 →