PRACTICAL IMPLEMENTATION AND PACKAGING TECHNOLOGIES FOR A LARGE-SCALE ATM SWITCHING-SYSTEM

被引:30
|
作者
ITOH, A [1 ]
TAKAHASHI, W [1 ]
NAGANO, H [1 ]
KURISAKA, M [1 ]
IWASAKI, S [1 ]
机构
[1] NEC CORP LTD,DIV INTEGRATED SWITCHING DEV,DEPT TECHNOL DEV,CHIBA,JAPAN
关键词
D O I
10.1109/49.105174
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes the practical implementation of a trial large-scale ATM switching system and packaging technologies. First, the architecture of the ATM switching system is discussed with an emphasis on system scalability. We introduce a building block architecture, in which switching capacity can be expanded in a modular fashion. Next, we look at the design of the ATM switching system including the ATM switch element. Then, the implementation of the VLSI's for the ATM switch which realize a highly modular system are explained. Bit-slice techniques are effectively used to realize a high-speed switch element as a CMOS VSLI chipset. Finally, we present a new edge-to-edge orthogonal packaging technique.
引用
收藏
页码:1280 / 1288
页数:9
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