PARAMETERS THAT INFLUENCE THE ULTRASONIC BOND QUALITY

被引：1
|
作者：
DERKS, PLLM
机构：
来源：
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY | 1983年 / 10卷 / 04期
关键词：
D O I：
10.1155/APEC.10.269
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：269 / 275
页数：7
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