RESEARCH ON NTC THERMALLY SENSITIVE POWDER MATERIALS FOR THICK-FILM THERMISTORS

被引：0
|
作者：
HAO, YD [1 ]
CHEN, LJ [1 ]
LIN, H [1 ]
ZHOU, DX [1 ]
GONG, SP [1 ]
机构：
[1] HUAZHONG UNIV SCI & TECHNOL,DEPT SOLID STATE ELECTR,WUHAN 430074,PEOPLES R CHINA
来源：
SENSORS AND ACTUATORS A-PHYSICAL | 1993年 / 35卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Negative temperature coefficient (NTC) thermally sensitive powder materials made of semiconductor ceramics are crucial for the fabrication of thick-film thermistors. This paper presents several new experimental methods and the results of research on NTC thermally sensitive semiconductor ceramics in the Mn-Co Ni and Mn-Co-Ni-Ru systems. Formulation of the constituents, preparation methods and preparation techniques for the materials are also described.
引用
收藏
页码：269 / 272
页数：4
相关论文
共 50 条
  • [21] Electrical properties of Ni-Mn-Co-(Fe) oxide thick-film NTC thermistors prepared by screen printing
    Park, K
    Bang, DY
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2003, 14 (02) : 81 - 87
  • [22] Novel uniaxial anemometer containing NTC thick film segmented thermistors
    Menicanin, A. B.
    Aleksic, O. S.
    Nikolic, M. V.
    Savic, S. M.
    Radojcic, B. M.
    2008 26TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS, 2008, : 349 - +
  • [23] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [24] Evaluation of compatibility of thick-film PTC thermistors and LTCC structures
    Belavic, D
    Hrovat, M
    Kita, J
    Holc, J
    Cilensek, J
    Golonka, L
    Dziedzic, A
    MICROELECTRONICS RELIABILITY, 2005, 45 (12) : 1924 - 1929
  • [25] TRENDS IN THICK-FILM MATERIALS
    MONES, AH
    ROSENBERG, RM
    SOLID STATE TECHNOLOGY, 1976, 19 (10) : 47 - 49
  • [26] THICK-FILM MATERIALS AND RELIABILITY
    GRAVES, PW
    ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
  • [27] Volume air flow sensors based on NTC thick film segmented thermistors
    Obrad, S. Aleksic
    Pantelija, Nikolic M.
    Konstantinos, Paraskevopoulos A.
    MICROELECTRONICS INTERNATIONAL, 2006, 23 (03) : 14 - 18
  • [28] ON THE THERMALLY ACCELERATED AGING OF THICK-FILM RESISTORS
    KHANNA, PK
    BHATNAGAR, SK
    GUST, W
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1994, 143 (01): : K33 - K36
  • [29] THICK-FILM RESISTORS AND THERMISTORS FOR 500-DEGREES-C OPERATION
    VEST, GW
    STEWART, JS
    REED, RL
    VEST, RW
    AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (08): : 830 - 830
  • [30] THICK-FILM MATERIALS AND TECHNIQUES.
    Ulrich, Donald R.
    Electronic Packaging and Production, 1974, 14 (07): : 276 - 285
12345