共 50 条
- [31] Behavior of antimony(III) during copper electrowinning in chloride solutions METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE, 1996, 27 (02): : 157 - 162
- [32] Electrochemical Behavior of Some Electroplates in Solutions for Coulometric Measurements of Their Thickness. III. Passivation Phenomena during the Dissolution of Copper Coatings Protection of Metals, 2001, 37 : 586 - 591
- [33] Electrochemical behavior of some electroplates in solutions for coulometric measurements of their thickness. III. Passivation phenomena during the dissolution of copper coatings PROTECTION OF METALS, 2001, 37 (06): : 586 - 591
- [39] Chloride Ion Effects on Anodic Dissolution of Copper in Aqueous NaCl Solutions under Argon Atmosphere JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY, 2008, 11 (03): : 159 - 164