IMPROVED VERY-HIGH-SPEED PACKAGED INGAAS PIN PUNCH-THROUGH PHOTODIODE

被引：57

作者：

BURRUS, CA ^{[1
]}

BOWERS, JE ^{[1
]}

TUCKER, RS ^{[1
]}

机构：

[1] AT&T BELL LABS,HOLMDEL LABS,HOLMDEL,NJ 07733

来源：

ELECTRONICS LETTERS | 1985年 / 21卷 / 07期

关键词：

D O I：

10.1049/el:19850186

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：262 / 263

页数：2

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