SLICING AND GRINDING SEMICONDUCTOR-MATERIALS

被引：0

作者：

BRANDT, G

机构：

来源：

INDUSTRIAL DIAMOND REVIEW | 1985年 / 45卷 / 02期

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D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：88 / 90

页数：3

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[21] INTERNATIONAL STANDARDS FOR SEMICONDUCTOR-MATERIALS
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[23] HELIUM MICROPROBE ANALYSIS OF SEMICONDUCTOR-MATERIALS
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[30] Precision grinding and slicing of semiconductor substrate wafers
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