CONDUCTIVE ADHESIVE FILM FOR DICING AND DIE BONDING

被引：0
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作者：
GLOSECKI, A
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来源：
SOLID STATE TECHNOLOGY | 1986年 / 29卷 / 08期
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：75 / 76
页数：2
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