CONDUCTIVE ADHESIVE FILM FOR DICING AND DIE BONDING

被引：0
|
作者：
GLOSECKI, A
机构：
来源：
SOLID STATE TECHNOLOGY | 1986年 / 29卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：75 / 76
页数：2
相关论文
共 50 条
  • [1] Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
    Zenner, Robert L. D.
    Murray, Cameron T.
    Fisher, Carl
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2008, 22 (14) : 1781 - 1797
  • [2] Temperature characterization in anisotropic conductive film adhesive bonding
    Zenner, Robert L. D.
    Murray, Cameron T.
    Fisher, Carl
    Journal of Adhesion Science and Technology, 2008, 22 (14): : 1781 - 1797
  • [3] A novel die bonding adhesive - Silver filled film
    Takeda, S
    Masuko, T
    Miyadera, Y
    Yamazaki, M
    Maekawa, I
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 518 - 524
  • [4] Bonding parameters of anisotropic conductive adhesive film and peeling strength
    Chen, X
    Zhang, J
    Jiao, CL
    Liu, YM
    ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 2005, 297-300 : 918 - 923
  • [5] The effect of the different Teflon film on anisotropic conductive adhesive film (ACF) bonding
    Zhang, Jun
    Chen, Xu
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 331 - +
  • [6] Conductive adhesive flip-chip bonding for bumped and unbumped die
    Connell, G
    Zenner, RLD
    Gerber, JA
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 274 - 278
  • [7] Conductive Adhesive Bonding Technology
    Hu, Xiao-Ming
    MECHANICS AND MATERIALS SCIENCE, 2018, : 341 - 351
  • [8] STRENGTH EVALUATION OF CONDUCTIVE ADHESIVE PASTE FOR DIE BONDING DURING REFLOW SOLDERING
    Ashida, Kisho
    Kawano, Kenya
    Tanaka, Naotaka
    Nishikizawa, Atsushi
    Koike, Nobuya
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 825 - 831
  • [9] Adhesive and conductive adhesive flip chip bonding
    Zenner, Robert L.D.
    Connell, Glen
    Gerber, Joel A.
    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1997, : 117 - 119
  • [10] Adhesive and conductive adhesive flip chip bonding
    Zenner, RLD
    Connell, G
    Gerber, JA
    3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 117 - 119
12345