ELECTRODEPOSITION OF BRIGHT TIN FROM NEUTRAL GLUCONATE BATHS

被引：0
|
作者：
SONODA, T [1 ]
NAWAFUNE, H [1 ]
MIZUMOTO, S [1 ]
机构：
[1] KONAN UNIV,FAC SCI,DEPT APPL CHEM,KOBE,JAPAN
来源：
PLATING AND SURFACE FINISHING | 1992年 / 79卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The mechanism of the action of additives on electrodeposition of bright tin from neutral gluconate baths was studied by means of a-c impedance measurements on the electrode surface. The double layer capacitance and the charge transfer resistance were obtained f rom impedance diagrams for additive-free, PEG-containing and PEG-formaldehyde-containing baths. By addition of formaldehyde to the PEG-containing bath, the polarization curve shifted to a noble potential, increased the double layer capacitance, and decreased the charge transfer resistance. In the bright tin plating from gluconate baths, formaldehyde was found to have a great effect on the surface morphology of tin deposits in the presence of PEG.
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页码：78 / 81
页数：4
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