STUDIES ON THE ADHESION OF POLYIMIDE COATINGS ON COPPER FOIL

被引：18
|
作者：
CHEN, KM
HO, SM
WANG, TH
KING, JS
CHANG, WC
CHENG, RP
HUNG, A
机构：
[1] MING HSIN ENGN COLL,DEPT CHEM ENGN,HSINCHU,TAIWAN
[2] NATL TAIWAN UNIV,DEPT CHEM,TAIPEI,TAIWAN
来源：
JOURNAL OF APPLIED POLYMER SCIENCE | 1992年 / 45卷 / 06期
关键词：
D O I：
10.1002/app.1992.070450602
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
The peel strength and the color of the copper foil peeled at 90 degrees from five different polyimide films were studied. The interfacial surfaces of copper foil and polyimide were examined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and energy dispersion analysis by X-ray (EDAX). There is a correlation between peel strength, and the color of the interfacial side copper caused by oxygen diffusion. Study of the imidization process carried out in vacuum indicates that the geometric arrangements of the atoms of polyimide also play a very important role in peel strength.
引用
收藏
页码：947 / 956
页数：10
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