HIGH ASPECT RATIO PHOTOELECTROCHEMICAL ETCHING OF COMPOUND SEMICONDUCTORS

被引:0
|
作者
CARRABBA, MM [1 ]
RAUH, RD [1 ]
机构
[1] EIC LABS INC,NORWOOD,MA 02062
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C175 / C175
页数:1
相关论文
共 50 条
  • [21] An overview: critical issues in the high aspect ratio dry etching
    Rangelow, IW
    VIDE-SCIENCE TECHNIQUE ET APPLICATIONS, 2002, 57 (303): : 24 - 39
  • [22] Study of High Aspect Ratio Silicon Etching Based on ICP
    Jiang, Hu
    Shun, Zhou
    Shuai, Hu
    Zhu Yufeng
    Liu Weiguo
    INTERNATIONAL CONFERENCE ON PHOTONICS AND OPTICAL ENGINEERING (ICPOE 2014), 2015, 9449
  • [23] High aspect ratio germanium nanowires obtained by dry etching
    Kevin Guilloy
    Nicolas Pauc
    Alban Gassenq
    Vincent Calvo
    MRS Advances, 2016, 1 (13) : 875 - 880
  • [24] Effect of Wafer Temperature on High Aspect Ratio Hardmask Etching
    S. Lee
    Y.-C. Tien
    Y.-W. Chang
    Plasma Chemistry and Plasma Processing, 2002, 22 : 627 - 637
  • [25] High aspect ratio etching of GaSb/AlGaAsSb for photonic crystals
    Nilsen, Tron Arne
    Martinez, Anthony
    Bugge, Renato
    Moscho, Aaron
    Lester, Luke F.
    Fimland, Bjorn-Ove
    PROGRESS IN SEMICONDUCTOR MATERIALS V-NOVEL MATERIALS AND ELECTRONIC AND OPTOELECTRONIC APPLICATIONS, 2006, 891 : 3 - +
  • [26] High aspect ratio germanium nanowires obtained by dry etching
    Guilloy, Kevin
    Pauc, Nicolas
    Gassenq, Alban
    Calvo, Vincent
    MRS ADVANCES, 2016, 1 (13): : 875 - 880
  • [27] DIRECT ETCHING OF HIGH ASPECT RATIO STRUCTURES THROUGH A STENCIL
    Villanueva, G.
    Vazquez-Mena, O.
    Hibert, C.
    Brugger, J.
    IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009), 2009, : 144 - 147
  • [28] Etching mechanism of high-aspect-ratio array structure
    Gao, Zhiting
    Ma, Zhuang
    Gao, Lihong
    Liu, Qiang
    Wang, Yuxiang
    Liu, Yanbo
    Wang, Lidong
    Hao, Yuyang
    Deng, Yuanhan
    MICROELECTRONIC ENGINEERING, 2023, 279
  • [29] RIE lag in high aspect ratio trench etching of silicon
    Jansen, H
    deBoer, M
    Wiegerink, R
    Tas, N
    Smulders, E
    Neagu, C
    Elwenspoek, M
    MICROELECTRONIC ENGINEERING, 1997, 35 (1-4) : 45 - 50
  • [30] Reactive ion etching for high aspect ratio silicon micromachining
    Rangelow, IW
    SURFACE & COATINGS TECHNOLOGY, 1997, 97 (1-3): : 140 - 150