MICRO-WINCHESTER MARKET AWAITS MICRO-DISKETTE STANDARDS

被引:0
|
作者
KALSTROM, D
机构
来源
MINI-MICRO SYSTEMS | 1983年 / 16卷 / 04期
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
引用
收藏
页码:175 / 176
页数:2
相关论文
共 50 条
  • [41] A MICRO MODEL OF THE FEDERAL-FUNDS MARKET - DISCUSSION
    SPINDT, PA
    JOURNAL OF FINANCE, 1985, 40 (03): : 988 - 990
  • [42] Micro-Franchising in the Bottom of the Pyramid Market: Rwanda
    Naatu, Felicia
    Alon, Ilan
    Uwamahoro, Rehema
    JOURNAL OF SOCIAL ENTREPRENEURSHIP, 2022, 13 (01) : 71 - 91
  • [43] EYEING THE FUTURE - WHERE THE OPPORTUNITIES LIE IN THE MICRO MARKET
    GREEN, W
    MICROCOMPUTING, 1984, 8 (07): : 6 - 7
  • [44] An Energy Market for Rural, Islanded Micro-grids
    Densmore, A.
    Prasad, G.
    PROCEEDINGS OF THE TWENTY-THIRD CONFERENCE ON THE DOMESTIC USE OF ENERGY, 2015, : 123 - 130
  • [45] Transforming Rehabilitation: The micro-physics of (market) power
    Tidmarsh, Matt
    PUNISHMENT & SOCIETY-INTERNATIONAL JOURNAL OF PENOLOGY, 2020, 22 (01): : 108 - 126
  • [46] Stock Market Simulation by Micro-Macro GAN
    Naritomi, Yusuke
    Adachi, Takanori
    2023 IEEE INTERNATIONAL CONFERENCE ON WEB INTELLIGENCE AND INTELLIGENT AGENT TECHNOLOGY, WI-IAT, 2023, : 600 - 607
  • [47] MICRO-INSURANCE IN EMERGING MARKET: CHAPTER BANGLADESH
    Parvez, Md Shahriar
    4TH ANNUAL EUROMED CONFERENCE OF THE EUROMED ACADEMY OF BUSINESS: BUSINESS RESEARCH CHALLENGES IN A TURBULENT ERA, 2011, : 1490 - 1511
  • [48] International market structure: global problems and micro solutions
    Pagano, Michael S.
    INTERNATIONAL JOURNAL OF MANAGERIAL FINANCE, 2009, 5 (01) : 5 - +
  • [49] Research on Innovation of Market Adaptability of Small and Micro Enterprises
    Liu, Xiansheng
    PROCEEDINGS OF THE 2017 INTERNATIONAL CONFERENCE ON INNOVATIONS IN ECONOMIC MANAGEMENT AND SOCIAL SCIENCE (IEMSS 2017), 2017, 29 : 1420 - 1425
  • [50] Mini, Micro, and Small Hydropower Plants are Returning to the Market
    Markin V.V.
    Kiselev N.P.
    Kmotrikov N.I.
    Power Technology and Engineering, 2020, 54 (04) : 494 - 499