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- [48] Electrodeposition of Au-Sn Alloys for Lead-free Solders: Au-rich Eutectic and Sn-rich Eutectic Compositions 2013 IEEE INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS (APM), 2013,
- [50] Aging effects on microstructure and GMR in Au-Co and Au-Co-X(X = Cu, Ni, Fe) bulk alloys IEEE Transactions on Magnetics, 1999, 35 (5 pt 1): : 2856 - 2858