STRAIN-INDUCED ANISOTROPY MEASUREMENT IN OXIDE-FILMS GROWN ON SILICON

被引:11
|
作者
PEDINOFF, ME [1 ]
MAYER, DC [1 ]
STAFSUDD, OM [1 ]
DUNN, GL [1 ]
机构
[1] UNIV CALIF LOS ANGELES,DEPT ELECT ENGN,LOS ANGELES,CA 90024
来源
APPLIED OPTICS | 1982年 / 21卷 / 18期
关键词
D O I
10.1364/AO.21.003307
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
引用
收藏
页码:3307 / 3313
页数:7
相关论文
共 50 条
  • [41] Simulation of strain-induced anisotropy for polymers with weighting functions
    Rolf Mahnken
    Christian Dammann
    Archive of Applied Mechanics, 2014, 84 : 21 - 41
  • [42] STRESS ANISOTROPY IN SILICON OXIDE FILMS
    PRIEST, J
    CASWELL, HL
    BUDO, Y
    JOURNAL OF APPLIED PHYSICS, 1963, 34 (02) : 347 - &
  • [43] ENHANCED ELECTRON INJECTION IN THERMAL OXIDE-FILMS ON SILICON
    OLCER, M
    BUHLMANN, HJ
    ILEGEMS, M
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (08) : C351 - C351
  • [44] VISCOELASTIC BEHAVIOR OF OXIDE-FILMS ON SILICON-CRYSTALS
    NISHINO, Y
    IMURA, T
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1982, 74 (01): : 193 - 200
  • [45] FORMATION OF THIN OXIDE-FILMS OF SILICON BY GAS PLASMA
    ABE, H
    EMOTO, H
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1976, 15 (05) : 925 - 926
  • [46] OPTICAL-PROPERTIES OF TANTALUM OXIDE-FILMS ON SILICON
    REVESZ, AG
    REYNOLDS, JH
    ALLISON, JF
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (06) : 889 - 894
  • [47] THE GROWTH AND TRANSPORT IN THERMAL OXIDE-FILMS FORMED ON SILICON
    HUSSEY, RJ
    BISAILLION, DA
    SPROULE, GI
    GRAHAM, MJ
    CORROSION SCIENCE, 1993, 35 (5-8) : 917 - 921
  • [48] GALLIUM DIFFUSION FROM DOPED OXIDE-FILMS INTO SILICON
    DANILICHEVA, TA
    MARKVICHEVA, VS
    NISNEVICH, YD
    INORGANIC MATERIALS, 1985, 21 (04) : 450 - 454
  • [49] DEFECT EQUILIBRIA AND GROWTH REACTIONS OF OXIDE-FILMS ON SILICON
    FOWKES, FM
    HESS, DW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (03) : C102 - C102
  • [50] Modeling of strain-induced Pockels effect in silicon
    Manganelli, C. L.
    Pintus, P.
    Bonati, C.
    OPTICS EXPRESS, 2015, 23 (22): : 28649 - 28666