INTERFACIAL ROUGHNESS IN HIGH-FREQUENCY MICROELECTRONIC INTERCONNECTIONS AND PACKAGING

被引：2
|
作者：
BHASIN, KB [1 ]
WARNER, JD [1 ]
LIU, DC [1 ]
ROMANOFSKY, RR [1 ]
机构：
[1] NASA,LEWIS RES CTR,CLEVELAND,OH 44135
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 03期
关键词：
D O I：
10.1116/1.573305
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：778 / 779
页数：2
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