SPAID SOFTWARE EASES CHIP-TEST BOTTLENECK

被引：0

|

作者：

SMITH, K

机构：

来源：

ELECTRONICSWEEK | 1984年 / 57卷 / 15期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：48 / &

相关论文

共 50 条

[41] Simulation software eases modeling of physical events
Gawel, R
ELECTRONIC DESIGN, 2000, 48 (10) : 48 - +
[42] OPC UA eases software integration tasks
Boyes, Walt
Control (Chicago, Ill), 2008, 21 (10):
[43] CMOS RISC CHIP SET EASES PALMTOP DESIGN
BURSKY, D
ELECTRONIC DESIGN, 1992, 40 (21) : 92 - &
[44] A LITTLE EXTRA CIRCUITRY ON CHIP AND SPECIAL SOFTWARE LETS VLSI TEST ITSELF CHIP BY CHIP AND BOARD BY BOARD
COMERFORD, RW
LYMAN, J
ELECTRONICS, 1983, 56 (05): : 109 - 109
[45] Test port eases PLD programming
不详
ELECTRONIC DESIGN, 1996, 44 (13) : 24 - 24
[46] CONFIGURABLE CHIP EASES CONTROL-SYSTEM DESIGN
BURSKY, D
ELECTRONIC DESIGN, 1988, 36 (24) : 63 - &
[47] COMPRESSION/EXPANSION CHIP EASES DOCUMENT STORAGE.
Williams, Tom
Electronic Systems Technology and Design/Computer Design's, 1985, 24 (13):
[48] SOFTWARE-DESIGN - BREAKING THE BOTTLENECK
GRAHAM, AK
IEEE SPECTRUM, 1982, 19 (03) : 43 - 50
[49] SOFTWARE AUTOMATION ATTACKS THE PROGRAMMING BOTTLENECK
SCHINDLER, M
ELECTRONIC DESIGN, 1981, 29 (23) : SS11 - SS16
[50] Flaw Detector Operating Software Eases Defect Sizing
不详
JOURNAL OF FAILURE ANALYSIS AND PREVENTION, 2005, 5 (03) : 31 - 31

← 1 2 3 4 5 →