ORIENTATION RELATIONS BETWEEN THIN EVAPORATED COPPER-FILMS AND COPPER(I) OXIDE

被引：2

作者：

BECK, L ^{[1
]}

GUNTER, JR ^{[1
]}

机构：

[1] UNIV ZURICH,INST INORGAN CHEM,CH-8057 ZURICH,SWITZERLAND

来源：

MICRON | 1983年 / 14卷 / 01期

关键词：

D O I：

10.1016/0047-7206(83)90031-6

中图分类号：

TH742 [显微镜];

学科分类号：

摘要：

引用

页码：53 / 56

页数：4

共 50 条

[31] AGING HISTORIES OF OPTICAL-CONSTANTS OF THERMALLY EVAPORATED SILVER AND COPPER-FILMS
KOMI, S
FUKUI, M
SHINTANI, Y
SURFACE SCIENCE, 1990, 237 (1-3) : 321 - 326
[32] INFLUENCE OF STRUCTURAL REARRANGEMENT ON THERMAL AND ELECTRICAL CONDUCTIVITIES OF NONEQUILIBRIUM THIN COPPER-FILMS EVAPORATED ON COOLED MICA SUBSTRATE
VASSILEV, PG
PHYSICS LETTERS A, 1975, A 51 (07) : 391 - 392
[33] Chemical and thermal reduction of thin films of copper(II) oxide and copper(I) oxide.
Kirsch, PD
Ekerdt, JG
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 221 : U318 - U318
[34] ON THE TEXTURE OF ELECTROLESS COPPER-FILMS
JUNGINGER, R
ELSNER, G
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (09) : 2304 - 2308
[35] GROWTH AND STRUCTURE OF THIN COPPER-FILMS ON (001) SURFACES OF NICKEL
CHAMBERS, A
JACKSON, DC
PHILOSOPHICAL MAGAZINE, 1975, 31 (06): : 1357 - 1371
[36] IN-SITU STRESS INVESTIGATIONS ON THIN COPPER-FILMS WITH THE STM
FRIES, T
OSTER, K
WANDELT, K
ADVANCED MATERIALS, 1994, 6 (06) : 473 - 476
[37] COMPLEX IMPEDANCE OF COPPER-FILMS
HOWARD, LL
TURNER, DA
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (02): : 331 - 333
[38] TWINS IN ELECTROLESS COPPER-FILMS
WOO, OT
REZEK, J
SCHLESINGER, M
CHOW, SL
MATERIALS SCIENCE AND ENGINEERING, 1975, 17 (01): : 165 - 168
[39] LASER-INDUCED MORPHOLOGY CHANGES IN THIN COPPER-FILMS
BLOCH, J
ZEIRI, Y
JOURNAL OF APPLIED PHYSICS, 1987, 61 (07) : 2637 - 2644
[40] ATOMIC-HYDROGEN ADSORPTION ON SINTERED THIN COPPER-FILMS
DUS, R
NOWICKA, E
LISOWSKI, W
WOLFRAM, Z
APPLIED SURFACE SCIENCE, 1995, 90 (03) : 277 - 282

← 1 2 3 4 5 →