THE INFLUENCE OF MICROSTRUCTURE ON THE THERMAL-CONDUCTIVITY OF ALUMINUM NITRIDE

Starting from three different commercial powders, AlN materials were densified by pressureless sintering under various temperature and time values in order to investigate the influence of microstructure on thermal conductivity. The influence of the sintering aids (3 wt % Y2O3 and 2 wt % CaC2) and of the forming processes (cold isostatic pressing and thermocompression of tape cast pieces) were also been evaluated. Thermal conductivity increased with the purity level of the starting powder and with an increasing the sintering temperature and soaking time. The highest thermal conductivity values (196 Wm(-1) K-1) were obtained with the purest powder and high temperature (1800 degrees C) sintering over long periods (6 h). No influence on thermal conductivity was detected from the forming technique.