INFLUENCE OF CURRENT REVERSALS ON THE THROWING POWER OF A SULFATE COPPER PLATING BATH

被引：0
|
作者：
KRUGLIKOV, SS
YARLYKOV, MM
YURCHUK, TE
机构：
来源：
SOVIET ELECTROCHEMISTRY | 1991年 / 27卷 / 03期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Current reversals were examined as a possibility for improving the uniformity of distribution of copper coatings produced in a sulfate bath. Conditions were defined under which the throwing power will rise to 73-76%.
引用
收藏
页码：269 / 273
页数：5
相关论文
共 50 条
  • [41] Acid sulfate & pyrophosphate copper plating
    Hamilton, AC
    PLATING AND SURFACE FINISHING, 2004, 91 (08): : 6 - 7
  • [42] Acid sulfate & pyrophosphate copper plating
    Hamilton, AC
    PLATING AND SURFACE FINISHING, 2002, 89 (08): : 16 - 17
  • [43] Acid sulfate & pyrophosphate copper plating
    Hamilton, AC
    PLATING AND SURFACE FINISHING, 2003, 90 (08): : 12 - 13
  • [44] Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation
    Li, Qingyang
    Hu, Jiaping
    Zhang, Jinqiu
    Yang, Peixia
    Hu, Yidong
    An, Maozhong
    CHEMICAL PHYSICS LETTERS, 2020, 757
  • [45] INFLUENCE OF CURRENT PULSE REPETITION RATE ON THROWING POWER OF CERTAIN ELECTROLYTES
    KOSTIN, NA
    PROTECTION OF METALS, 1983, 19 (03): : 400 - 402
  • [46] MECHANISM OF CHROMIUM ELECTRODEPOSITION IN SULFATE-CATALYZED PLATING BATH
    DORGAI, C
    TOMCSANYI, L
    MAGYAR KEMIAI FOLYOIRAT, 1992, 98 (02): : 63 - 69
  • [47] THE EFFECT OF ULTRASONIC AGITATION ON COPPER PLATING IN AN ACID BATH
    HSIAO, MC
    WAN, CC
    PLATING AND SURFACE FINISHING, 1989, 76 (03): : 46 - 50
  • [48] RATE MODEL FOR ADDITIVE COPPER PLATING BATH.
    McBride, D.G.
    Rickert, R.G.
    1984, (26):
  • [49] Practical monitoring of filling performance in a copper plating bath
    Dow, WP
    Yen, MY
    Chou, CW
    Liu, CW
    Yang, WH
    Chen, CH
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2006, 9 (08) : C134 - C137
  • [50] Application of precision filtration to an electroless copper plating bath
    Fujinami, T
    Honma, H
    PLATING AND SURFACE FINISHING, 1997, 84 (08): : 22 - 24
12345