Review of Sc microalloying effects in Al–Cu alloys

Artificially controlling the solid-state precipitation in aluminum (Al) alloys is an efficient way to achieve well-performed properties,and the microalloying strategy is the most frequently adopted method for such a purpose.In this paper,recent advances in lengthscale-dependent scandium (Sc) microalloying effects in Al–Cu model alloys are reviewed.In coarse-grained Al–Cu alloys,the Sc-aided Cu/Sc/vacancies complexes that act as heterogeneous nuclei and Sc segregation at the θ′-Al2Cu/matrix interface that reduces interfacial energy contribute significantly to θ′precipitation.By grain size refinement to the fine/ultrafine-grained scale,the strongly bonded Cu/Sc/vacancies complexes inhibit Cu and vacancy diffusing toward grain boundaries,promoting the desired intragranular θ′precipitation.At nanocrystalline scale,the applied high strain producing high-density vacancies results in the formation of a large quantity of (Cu Sc,vacancy)-rich atomic complexes with high thermal stability,outstandingly improving the strength/ductility synergy and preventing the intractable low-temperature precipitation.This review recommends the use of microalloying technology to modify the precipitation behaviors toward better combined mechanical properties and thermal stability in Al alloys.