Warpage of Powder Injection Molded Copper Structure

被引：0
|
作者：
Hanlyun Cho
Jae Man Park
Junsuk Rho
Seong Jin Park
机构：
[1] Pohang University of Science and Technology (POSTECH),Department of Mechanical Engineering
[2] Pohang University of Science and Technology (POSTECH),Department of Chemical Engineering
来源：
Metals and Materials International | 2021年 / 27卷
关键词：
Copper powder injection molding; Warpage; Debinding; Sensitivity analysis;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1131 / 1137
页数：6
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