Loop Thermosyphon for Cooling Heat-Loaded Electronics Components

被引：0
|
作者：
L. L. Vasiliev
A. S. Zhuravlyov
M. A. Kuz′mich
V. K. Kulikovskii
V. A. Olekhnovich
机构：
[1] A. V. Luikov Heat and Mass Transfer Institute of the National Academy of Sciences of Belarus,
来源：
Journal of Engineering Physics and Thermophysics | 2023年 / 96卷
关键词：
Heat pipe; Thermosyphon; Heat exchange; Cooling; Phase transition; Porous wick;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fluxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1°C/W.
引用
收藏
页码：1708 / 1715
页数：7
相关论文
共 50 条
  • [21] DUAL- EVAPORATOR THERMOSYPHON COOLING SYSTEM FOR ELECTRONICS COOLING
    Cataldo, Filippo
    Amalfi, Raffaele Luca
    PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022, 2022,
  • [22] Investigation on Heat Transfer Performance of Loop Thermosyphon for Inner Cooling of Motorized Spindle
    Li F.
    Gao J.
    Shi X.
    Liang F.
    Tang R.
    Shi, Xiaojun, 2017, Xi'an Jiaotong University (51): : 90 - 97
  • [23] Loop thermosyphon design for cooling of large area, high heat flux sources
    Hartenstine, John R.
    Banner, Richard W., III
    Montgomery, Jared R.
    Semenic, Tadej
    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1, 2007, : 715 - 722
  • [24] Optimization of thermoelectric cooling regimes for heat-loaded elements taking into account the thermal resistance of the heat-spreading system
    Vasil'ev, E. N.
    TECHNICAL PHYSICS, 2017, 62 (09) : 1300 - 1306
  • [25] Cooling of Electronic Components by an Aluminum Loop Thermosyphon Containing Two Evaporators and One Condenser
    Artyukh, A. A.
    Sadchenko, D. I.
    Vasiliev, L. L.
    JOURNAL OF ENGINEERING PHYSICS AND THERMOPHYSICS, 2024, : 566 - 574
  • [26] Optimization of thermoelectric cooling regimes for heat-loaded elements taking into account the thermal resistance of the heat-spreading system
    E. N. Vasil’ev
    Technical Physics, 2017, 62 : 1300 - 1306
  • [27] Small loop heat pipe with plastic wick for electronics cooling
    Department of Aerospace Engineering, Nagoya University, Nagoya 464-8603, Japan
    Jpn. J. Appl. Phys., 11 PART 2
  • [28] Development of a MEMS micro loop heat pipe for electronics cooling
    Shuja, A.
    Parimi, S.
    Medis, P.
    Gerner, F. M.
    Henderson, H. T.
    Gerner, F. M.
    THERMES 2007: THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2007, : 233 - +
  • [29] Small Loop Heat Pipe with Plastic Wick for Electronics Cooling
    Nagano, Hosei
    Nishigawara, Masahito
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (11)
  • [30] Miniature loop heat pipes - A promising means for cooling electronics
    Maydanik, YF
    Vershinin, SV
    Korukov, MA
    Ochterbeck, JM
    ITHERM 2004, VOL 2, 2004, : 60 - 66
12345