Molecular dynamics investigations of the strengthening of Al-Cu alloys during thermal ageing

被引:0
|
作者
W. Verestek
A.-P. Prskalo
M. Hummel
P. Binkele
S. Schmauder
机构
[1] University of Stuttgart,Institute for Materials Testing, Materials Science and Strength of Materials
来源
Physical Mesomechanics | 2017年 / 20卷
关键词
molecular dynamics; Al-Cu alloys; Guinier-Preston zones; dislocation; critical resolved shear stress; precipitate strengthening; embedded atom method potential;
D O I
暂无
中图分类号
学科分类号
摘要
Classical molecular dynamics simulations of the interaction of edge dislocations with solid soluted copper atoms and Guinier-Preston zones (I and II) in aluminium are performed using embedded atom method potentials. Hereby, the strengthening mechanism and its modulus are identified for different stages of thermally aged Al-Cu alloys. Critical resolved shear stresses are calculated for different concentrations of solid soluted copper. In case of precipitate strengthening, the Guinier-Preston zone size, its orientation and offset from the dislocation plane are taken as simulation parameters. It is found that in case of solid soluted copper, the critical resolved shear stress is proportional to the copper concentration. In case of the two subsequent aging stages both the dislocation depinning mechanism as well as the depinning stress are highly dependent on the Guinier-Preston zone orientation and to a lesser degree to its size.
引用
收藏
页码:291 / 304
页数:13
相关论文
共 50 条
  • [21] Cyclic oxidation processes during anodizing of Al-Cu alloys
    Iglesias-Rubianes, L.
    Garcia-Vergara, S. J.
    Skeldon, P.
    Thompson, G. E.
    Ferguson, J.
    Beneke, M.
    ELECTROCHIMICA ACTA, 2007, 52 (24) : 7148 - 7157
  • [22] Molecular Dynamics Simulations of Atomic Diffusion during the Al-Cu Ultrasonic Welding Process
    Yang, Jingwei
    Zhang, Jie
    Qiao, Jian
    MATERIALS, 2019, 12 (14):
  • [23] Interfacial stability of θ′/Al in Al-Cu alloys
    Kim, Kyoungdoc
    Zhou, Bi-Cheng
    Wolverton, C.
    SCRIPTA MATERIALIA, 2019, 159 : 99 - 103
  • [24] Behaviour of copper during alkaline corrosion of Al-Cu alloys
    Liu, Y.
    Arenas, M. A.
    Garcia-Vergara, S. J.
    Hashimoto, T.
    Skeldon, P.
    Thompson, G. E.
    Habazaki, H.
    Bailey, P.
    Noakes, T. C. Q.
    CORROSION SCIENCE, 2008, 50 (05) : 1475 - 1480
  • [25] APPARENT SOLID REGION OF AL-CU ALLOYS DURING SOLIDIFICATION
    YAMAUCHI, I
    KISHIDA, K
    OHNAKA, I
    FUKUSAKO, T
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1977, 41 (06) : 589 - 595
  • [26] Experimental investigations on the temporal and spatial behaviors of the PLC effect in Al-Cu alloys
    Jiang, HF
    Zhang, QC
    Jiang, ZY
    Wu, XP
    ACTA METALLURGICA SINICA, 2005, 41 (07) : 727 - 732
  • [27] Molecular dynamics simulation of diffusion bonding of Al-Cu interface
    Li, Chang
    Li, Dongxu
    Tao, Xiaoma
    Chen, Hongmei
    Ouyang, Yifang
    MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2014, 22 (06)
  • [28] Analysis of the Influence of Thermal Treatment on the Dry Turning of Al-Cu Alloys
    Salguero, J.
    Carrilero, M. S.
    Batista, M.
    Alvarez, M.
    Marcos, M.
    THIRD MANUFACTURING ENGINEERING SOCIETY INTERNATIONAL CONFERENCE: MESIC-09, 2009, 1181 : 594 - +
  • [29] Thermal expansion of Al-Cu alloys after conditioning and heat treatment
    Afanas'ev, V. K.
    Malyuh, M. A.
    Popova, M., V
    Leis, V. A.
    Dolgova, S., V
    OBRABOTKA METALLOV-METAL WORKING AND MATERIAL SCIENCE, 2016, (02): : 87 - 94
  • [30] Microplasma oxidation of Al-Cu alloys
    Moskovskij Inst Stali i Splavov, Moscow, Russia
    Zashchita Metallov, 1995, 31 (05): : 523 - 531